Summary
Further key aspects of the report indicate that:
Chapter 1: Research Scope: Product Definition, Type, End-Use & Methodology
Chapter 2: Global Industry Summary
Chapter 3: Market Dynamics
Chapter 4: Global Market Segmentation by region, type and End-Use
Chapter 5: North America Market Segmentation by region, type and End-Use
Chapter 6: Europe Market Segmentation by region, type and End-Use
Chapter 7: Asia-Pacific Market Segmentation by region, type and End-Use
Chapter 8: South America Market Segmentation by region, type and End-Use
Chapter 9: Middle East and Africa Market Segmentation by region, type and End-Use.
Chapter 10: Market Competition by Companies
Chapter 11: Market forecast and environment forecast.
Chapter 12: Industry Summary.
The global Wafer Level Packaging Technologies market has the potential to grow with xx million USD with growing CAGR in the forecast period from 2021f to 2026f. Factors driving the market for Wafer Level Packaging Technologies are the significant development of demand and improvement of COVID-19 and geo-economics.
Based on the type of product, the global Wafer Level Packaging Technologies market segmented into
Fan-In Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Based on the end-use, the global Wafer Level Packaging Technologies market classified into
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Others
Based on geography, the global Wafer Level Packaging Technologies market segmented into
North America [U.S., Canada, Mexico]
Europe [Germany, UK, France, Italy, Rest of Europe]
Asia-Pacific [China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific]
South America [Brazil, Argentina, Rest of Latin America]
Middle East & Africa [GCC, North Africa, South Africa, Rest of Middle East and Africa]
And the major players included in the report are
Samsung Electro-Mechanics
TSMC
Amkor Technology
Orbotech
Advanced Semiconductor Engineering
Deca Technologies
STATS ChipPAC
Nepes
Table of Contents
1 RESEARCH SCOPE
1.1 Research Product Definition
1.2 Research Segmentation
1.2.1 Product Type
1.2.2 Main product Type of Major Players
1.3 Demand Overview
1.4 Research Methodology
2 GLOBAL WAFER LEVEL PACKAGING TECHNOLOGIES INDUSTRY
2.1 Summary about Wafer Level Packaging Technologies Industry
2.2 Wafer Level Packaging Technologies Market Trends
2.2.1 Wafer Level Packaging Technologies Production & Consumption Trends
2.2.2 Wafer Level Packaging Technologies Demand Structure Trends
2.3 Wafer Level Packaging Technologies Cost & Price
3 MARKET DYNAMICS
3.1 Manufacturing & Purchasing Behavior in 2020
3.2 Market Development under the Impact of COVID-19
3.2.1 Drivers
3.2.2 Restraints
3.2.3 Opportunity
3.2.4 Risk
4 GLOBAL MARKET SEGMENTATION
4.1 Region Segmentation (2017 to 2021f)
4.1.1 North America (U.S., Canada and Mexico)
4.1.2 Europe (Germany, UK, France, Italy, Rest of Europe)
4.1.3 Asia-Pacific (China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific)
4.1.4 South America (Brazil,, Argentina, Rest of Latin America)
4.1.5 Middle East and Africa (GCC, North Africa, South Africa, Rest of Middle East and Africa)
4.2 Product Type Segmentation (2017 to 2021f)
4.2.1 Fan-In Wafer-Level Packaging
4.2.2 Fan-Out Wafer-Level Packaging
4.3 Consumption Segmentation (2017 to 2021f)
4.3.1 CMOS Image Sensor
4.3.2 Wireless Connectivity
4.3.3 Logic and Memory IC
4.3.4 MEMS and Sensor
4.3.5 Analog and Mixed IC
4.3.6 Others
5 NORTH AMERICA MARKET SEGMENT
5.1 Region Segmentation (2017 to 2021f)
5.1.1 U.S.
5.1.2 Canada
5.1.3 Mexico
5.2 Product Type Segmentation (2017 to 2021f)
5.2.1 Fan-In Wafer-Level Packaging
5.2.2 Fan-Out Wafer-Level Packaging
5.3 Consumption Segmentation (2017 to 2021f)
5.3.1 CMOS Image Sensor
5.3.2 Wireless Connectivity
5.3.3 Logic and Memory IC
5.3.4 MEMS and Sensor
5.3.5 Analog and Mixed IC
5.3.6 Others
5.4 Impact of COVID-19 in North America
6 EUROPE MARKET SEGMENTATION
6.1 Region Segmentation (2017 to 2021f)
6.1.1 Germany
6.1.2 UK
6.1.3 France
6.1.4 Italy
6.1.5 Rest of Europe
6.2 Product Type Segmentation (2017 to 2021f)
6.2.1 Fan-In Wafer-Level Packaging
6.2.2 Fan-Out Wafer-Level Packaging
6.3 Consumption Segmentation (2017 to 2021f)
6.3.1 CMOS Image Sensor
6.3.2 Wireless Connectivity
6.3.3 Logic and Memory IC
6.3.4 MEMS and Sensor
6.3.5 Analog and Mixed IC
6.3.6 Others
6.4 Impact of COVID-19 in Europe
7 ASIA-PACIFIC MARKET SEGMENTATION
7.1 Region Segmentation (2017 to 2021f)
7.1.1 China
7.1.2 India
7.1.3 Japan
7.1.4 South Korea
7.1.5 Southeast Asia
7.1.6 Australia
7.1.7 Rest of Asia Pacific
7.2 Product Type Segmentation (2017 to 2021f)
7.2.1 Fan-In Wafer-Level Packaging
7.2.2 Fan-Out Wafer-Level Packaging
7.3 Consumption Segmentation (2017 to 2021f)
7.3.1 CMOS Image Sensor
7.3.2 Wireless Connectivity
7.3.3 Logic and Memory IC
7.3.4 MEMS and Sensor
7.3.5 Analog and Mixed IC
7.3.6 Others
7.4 Impact of COVID-19 in Europe
8 SOUTH AMERICA MARKET SEGMENTATION
8.1 Region Segmentation (2017 to 2021f)
8.1.1 Brazil
8.1.2 Argentina
8.1.3 Rest of Latin America
8.2 Product Type Segmentation (2017 to 2021f)
8.2.1 Fan-In Wafer-Level Packaging
8.2.2 Fan-Out Wafer-Level Packaging
8.3 Consumption Segmentation (2017 to 2021f)
8.3.1 CMOS Image Sensor
8.3.2 Wireless Connectivity
8.3.3 Logic and Memory IC
8.3.4 MEMS and Sensor
8.3.5 Analog and Mixed IC
8.3.6 Others
8.4 Impact of COVID-19 in Europe
9 MIDDLE EAST AND AFRICA MARKET SEGMENTATION
9.1 Region Segmentation (2017 to 2021f)
9.1.1 GCC
9.1.2 North Africa
9.1.3 South Africa
9.1.4 Rest of Middle East and Africa
9.2 Product Type Segmentation (2017 to 2021f)
9.2.1 Fan-In Wafer-Level Packaging
9.2.2 Fan-Out Wafer-Level Packaging
9.3 Consumption Segmentation (2017 to 2021f)
9.3.1 CMOS Image Sensor
9.3.2 Wireless Connectivity
9.3.3 Logic and Memory IC
9.3.4 MEMS and Sensor
9.3.5 Analog and Mixed IC
9.3.6 Others
9.4 Impact of COVID-19 in Europe
10 COMPETITION OF MAJOR PLAYERS
10.1 Brief Introduction of Major Players
10.1.1 Samsung Electro-Mechanics
10.1.2 TSMC
10.1.3 Amkor Technology
10.1.4 Orbotech
10.1.5 Advanced Semiconductor Engineering
10.1.6 Deca Technologies
10.1.7 STATS ChipPAC
10.1.8 Nepes
10.2 Wafer Level Packaging Technologies Sales Date of Major Players (2017-2020e)
10.2.1 Samsung Electro-Mechanics
10.2.2 TSMC
10.2.3 Amkor Technology
10.2.4 Orbotech
10.2.5 Advanced Semiconductor Engineering
10.2.6 Deca Technologies
10.2.7 STATS ChipPAC
10.2.8 Nepes
10.3 Market Distribution of Major Players
10.4 Global Competition Segmentation
11 MARKET FORECAST
11.1 Forecast by Region
11.2 Forecast by Demand
11.3 Environment Forecast
11.3.1 Impact of COVID-19
11.3.2 Geopolitics Overview
11.3.3 Economic Overview of Major Countries
12 REPORT SUMMARY STATEMENT
List of Table
1.Table Wafer Level Packaging Technologies Product Type Overview
2.Table Wafer Level Packaging Technologies Product Type Market Share List
3.Table Wafer Level Packaging Technologies Product Type of Major Players
4.Table Brief Introduction of Samsung Electro-Mechanics
5.Table Brief Introduction of TSMC
6.Table Brief Introduction of Amkor Technology
7.Table Brief Introduction of Orbotech
8.Table Brief Introduction of Advanced Semiconductor Engineering
9.Table Brief Introduction of Deca Technologies
10.Table Brief Introduction of STATS ChipPAC
11.Table Brief Introduction of Nepes
12.Table Products & Services of Samsung Electro-Mechanics
13.Table Products & Services of TSMC
14.Table Products & Services of Amkor Technology
15.Table Products & Services of Orbotech
16.Table Products & Services of Advanced Semiconductor Engineering
17.Table Products & Services of Deca Technologies
18.Table Products & Services of STATS ChipPAC
19.Table Products & Services of Nepes
20.Table Market Distribution of Major Players
21.Table Global Major Players Sales Revenue (Million USD) 2017-2020e
22.Table Global Major Players Sales Revenue (Million USD) Share 2017-2020e
23.Table Global Wafer Level Packaging Technologies Market Forecast (Million USD) by Region 2021f-2026f
24.Table Global Wafer Level Packaging Technologies Market Forecast (Million USD) Share by Region 2021f-2026f
25.Table Global Wafer Level Packaging Technologies Market Forecast (Million USD) by Demand 2021f-2026f
26.Table Global Wafer Level Packaging Technologies Market Forecast (Million USD) Share by Demand 2021f-2026f
List of Figure
1.Figure Global Wafer Level Packaging Technologies Market Size under the Impact of COVID-19, 2017-2021f (USD Million)
2.Figure Global Wafer Level Packaging Technologies Market by Region under the Impact of COVID-19, 2017-2021f (USD Million)
3.Figure Global Wafer Level Packaging Technologies Market by Product Type under the Impact of COVID-19, 2017-2021f (USD Million)
4.Figure Global Wafer Level Packaging Technologies Market by Demand under the Impact of COVID-19, 2017-2021f (USD Million)
5.Figure Global Wafer Level Packaging Technologies Production by Region under the Impact of COVID-19, 2021-2026 (USD Million)
6.Figure Global Wafer Level Packaging Technologies Consumption by Region under the Impact of COVID-19, 2021-2026 (USD Million)
7.Figure Global Wafer Level Packaging Technologies Consumption by Type under the Impact of COVID-19, 2021-2026 (USD Million)
8.Figure North America Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
9.Figure Europe Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
10.Figure Asia-Pacific Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
11.Figure South America Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
12.Figure Middle East and Africa Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
13.Figure Fan-In Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
14.Figure Fan-Out Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
15.Figure CMOS Image Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
16.Figure Wireless Connectivity Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
17.Figure Logic and Memory IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
18.Figure MEMS and Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
19.Figure Analog and Mixed IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
20.Figure Others Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
21.Figure U.S. Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
22.Figure Canada Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
23.Figure Mexico Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
24.Figure Fan-In Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
25.Figure Fan-Out Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
26.Figure CMOS Image Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
27.Figure Wireless Connectivity Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
28.Figure Logic and Memory IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
29.Figure MEMS and Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
30.Figure Analog and Mixed IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
31.Figure Others Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
32.Figure Germany Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
33.Figure UK Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
34.Figure France Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
35.Figure Italy Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
36.Figure Rest of Europe Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
37.Figure Fan-In Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
38.Figure Fan-Out Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
39.Figure CMOS Image Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
40.Figure Wireless Connectivity Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
41.Figure Logic and Memory IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
42.Figure MEMS and Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
43.Figure Analog and Mixed IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
44.Figure Others Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
45.Figure China Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
46.Figure India Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
47.Figure Japan Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
48.Figure South Korea Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
49.Figure Southeast Asia Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
50.Figure Australia Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
51.Figure Rest of Asia Pacific Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
52.Figure Fan-In Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
53.Figure Fan-Out Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
54.Figure CMOS Image Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
55.Figure Wireless Connectivity Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
56.Figure Logic and Memory IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
57.Figure MEMS and Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
58.Figure Analog and Mixed IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
59.Figure Others Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
60.Figure Brazil Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
61.Figure Argentina Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
62.Figure Rest of Latin America Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
63.Figure Fan-In Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
64.Figure Fan-Out Wafer-Level Packaging Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
65.Figure CMOS Image Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
66.Figure Wireless Connectivity Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
67.Figure Logic and Memory IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
68.Figure MEMS and Sensor Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
69.Figure Analog and Mixed IC Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
70.Figure Others Segmentation Market Size (USD Million) 2017-2021f and Year-over-year (YOY) Growth (%) 2018-2021f
71.Figure GCC Market Size (USD Million) 2017-2021f and Year-
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