According to Verified Market Research, the Global Substrate-Like PCB Market was valued at USD 1.01 Billion in 2018 and is projected to reach USD 3.19 Billion by 2026, growing at a CAGR of 15.5% from 2019 to 2026.
What is Substrate-Like PCB?
Substrate-like PCBs (SLPs) are known to be the next evolution of high-end high density interconnector PCBs with higher density. Substrate-like PCB technology will replace the previous HDI PCB technology. In the report, the market outlook section mainly encompasses fundamental dynamics of the market which include drivers, restraints, opportunities and challenges faced by the industry. Drivers and Restraints are intrinsic factors whereas opportunities and challenges are extrinsic factors of the market.
High adoption rate of SLPs by leading OEMS, growing demand for smart consumer electronics and wearable devices along with various benefits offered by SLPs have been driving the global substrate-like PCB market. On the other hand, higher setup costs associated with SLPs might act as a restraint for the overall market at a global level.
Verified Market Research narrows down the available data using primary sources to validate the data and use it in compiling a full-fledged market research study. The report contains a quantitative and qualitative estimation of market elements which interests the client. The "Global Substrate-Like PCB Market" is mainly bifurcated into sub-segments which can provide a classified data regarding latest trends in the market. This can be of a great use in gaining knowledge about the cutting-edge technologies in the market.
Global Substrate-Like PCB Market Competitive Landscape
The "Global Substrate-Like PCB Market" study report will provide a valuable insight with an emphasis on global market including some of the major players as given below:
• Kinsus Interconnect Technology
• Ibiden
• Compeq
• Unimicron
• AT&S
Our market analysis also entails a section solely dedicated for such major players wherein our analysts provide an insight to the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share and market ranking analysis of the above mentioned players globally.
Research Methodology of Verified Market Research:
To know more about the Research Methodology and other aspects of the research study, kindly get in touch with our sales team at Verified Market Research.
Reasons to Purchase this Report
• Qualitative and quantitative analysis of the market based on segmentation involving both economic as well as non-economic factors
• Provision of market value (USD Billion) data for each segment and sub-segment
• Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
• Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
• Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions and acquisitions in the past five years of companies profiled
Customization of the Report
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1 INTRODUCTION OF GLOBAL SUBSTRATE-LIKE PCB MARKET
1.1 Overview of the Market
1.2 Scope of Report
1.3 Assumptions
2 EXECUTIVE SUMMARY
3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH
3.1 Data Mining
3.2 Validation
3.3 Primary Interviews
3.4 List of Data Sources
4 GLOBAL SUBSTRATE-LIKE PCB MARKET OUTLOOK
4.1 Overview
4.2 Market Dynamics
4.2.1 Drivers
4.2.2 Restraints
4.2.3 Opportunities
4.3 Porters Five Force Model
4.4 Value Chain Analysis
4.5 Regulatory Framework
5 GLOBAL SUBSTRATE-LIKE PCB MARKET, BY LINE/SPACE
5.1 Overview
5.2 25/25µm and 30/30µm Line/Space
5.3 Less Than 25/25 µm Line/Space
6 GLOBAL SUBSTRATE-LIKE PCB MARKET, BY APPLICATION
6.1 Overview
6.2 Consumer Electronics
6.3 Computing and Communications
6.4 Automotive
6.5 Medical
6.6 Industrial
6.7 Military, Defense, and Aerospace
7 GLOBAL SUBSTRATE-LIKE PCB MARKET, BY INSPECTION TECHNOLOGY
7.1 Overview
7.2 Automated Optical Inspection (AOI)
7.3 Direct Imaging (DI) Or Laser Direct Imaging (LDI)
7.4 Automated Optical Shaping (AOS)
8 GLOBAL SUBSTRATE-LIKE PCB MARKET, BY GEOGRAPHY
8.1 Overview
8.2 North America
8.2.1 U.S.
8.2.2 Canada
8.2.3 Mexico
8.3 Europe
8.3.1 Germany
8.3.2 U.K.
8.3.3 France
8.3.4 Rest of Europe
8.4 Asia Pacific
8.4.1 China
8.4.2 Japan
8.4.3 India
8.4.4 Rest of Asia Pacific
8.5 Latin America
8.5.1 Brazil
8.5.2 Argentina
8.6 Rest of the World
9 GLOBAL SUBSTRATE-LIKE PCB MARKET COMPETITIVE LANDSCAPE
9.1 Overview
9.2 Company Market Share
9.3 Vendor Landscape
9.4 Key Development Strategies
10 COMPANY PROFILES
10.1 Kinsus Interconnect Technology
10.1.1 Overview
10.1.2 Financial Performance
10.1.3 Product Outlook
10.1.4 Key Developments
10.2 Ibiden
10.2.1 Overview
10.2.2 Financial Performance
10.2.3 Product Outlook
10.2.4 Key Developments
10.3 Compeq
10.3.1 Overview
10.3.2 Financial Performance
10.3.3 Product Outlook
10.3.4 Key Developments
10.4 Unimicron
10.4.1 Overview
10.4.2 Financial Performance
10.4.3 Product Outlook
10.4.4 Key Developments
10.5 AT&S
10.5.1 Overview
10.5.2 Financial Performance
10.5.3 Product Outlook
10.5.4 Key Developments
10.6 TTM Technologies
10.6.1 Overview
10.6.2 Financial Performance
10.6.3 Product Outlook
10.6.4 Key Developments
10.7 Samsung Electro-Mechanics
10.7.1 Overview
10.7.2 Financial Performance
10.7.3 Product Outlook
10.7.4 Key Developments
10.8 Korea Circuit
10.8.1 Overview
10.8.2 Financial Performance
10.8.3 Product Outlook
10.8.4 Key Developments
10.9 Zhen Ding Technology
10.9.1 Overview
10.9.2 Financial Performance
10.9.3 Product Outlook
10.9.4 Key Developments
10.10 Daeduck Gds Company
10.10.1 Overview
10.10.2 Financial Performance
10.10.3 Product Outlook
10.10.4 Key Developments
10.11 Tripod Technology Corp
10.11.1 Overview
10.11.2 Financial Performance
10.11.3 Product Outlook
10.11.4 Key Developments
11 Appendix
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