The global flip chip market, in terms of revenue, is expected to grow by 6.3 percent annually through 2027, according to a new report by Gen Consulting Company.
The report provides in-depth analysis and insights regarding the current global market scenario, latest trends and drivers into global flip chip market. It offers an exclusive insight into various details such as market size, key trends, competitive landscape, growth rate and market segments.
The flip chip market is segmented on the basis of packaging technology, bumping technology, end user, and region. The flip chip market is segmented as below:
By packaging technology:
- 2.5D IC
- 2D IC
- 3D IC
By bumping technology:
- copper pillar
- gold bumping
- solder bumping
- others
By end user:
- aerospace & defense
- automotive & transport
- electronics
- healthcare
- industrial
- IT
- others
By region:
- region
- Asia-Pacific
- Europe
- North America
- Middle East and Africa (MEA)
- South America
The report explores the recent developments and profiles of key vendors in the Global Flip Chip Market, including Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., Fujitsu Limited, IBM Corporation, Intel Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated, among others.
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Historical & Forecast Period
This research report provides analysis for each segment from 2017 to 2027 considering 2020 to be the base year.
Scope of the Report
- To analyze and forecast the market size of the global flip chip market.
- To classify and forecast the global flip chip market based on packaging technology, bumping technology, end user, and region.
- To identify drivers and challenges for the global flip chip market.
- To examine competitive developments such as mergers & acquisitions, agreements, collaborations and partnerships, etc., in the global flip chip market.
- To conduct pricing analysis for the global flip chip market.
- To identify and analyze the profile of leading players operating in the global flip chip market.
Why Choose This Report
- Gain a reliable outlook of the global flip chip market forecasts from 2021 to 2027 across scenarios.
- Identify growth segments for investment.
- Stay ahead of competitors through company profiles and market data.
- The market estimate for ease of analysis across scenarios in Excel format.
- Strategy consulting and research support for three months.
- Print authentication provided for the single-user license.
Part 1. Introduction
1.1 Market definition
1.2 Key benefits
1.3 Market segment
Part 2. Methodology
2.1 Primary
2.2 Secondary
Part 3. Executive summary
Part 4. Market overview
4.1 Introduction
4.2 Market dynamics
4.2.1 Drivers
4.2.2 Restraints
Part 5. Global market for flip chip by packaging technology
5.1 2.5D IC
5.1.1 Market size and forecast
5.2 2D IC
5.2.1 Market size and forecast
5.3 3D IC
5.3.1 Market size and forecast
Part 6. Global market for flip chip by bumping technology
6.1 Copper pillar
6.1.1 Market size and forecast
6.2 Gold bumping
6.2.1 Market size and forecast
6.3 Solder bumping
6.3.1 Market size and forecast
6.4 Others
6.4.1 Market size and forecast
Part 7. Global market for flip chip by end user
7.1 Aerospace & defense
7.1.1 Market size and forecast
7.2 Automotive & transport
7.2.1 Market size and forecast
7.3 Electronics
7.3.1 Market size and forecast
7.4 Healthcare
7.4.1 Market size and forecast
7.5 Industrial
7.5.1 Market size and forecast
7.6 IT
7.6.1 Market size and forecast
7.7 Others
7.7.1 Market size and forecast
Part 8. Global market for flip chip by region
8.1 Asia-Pacific
8.1.1 Market size and forecast
8.2 Europe
8.2.1 Market size and forecast
8.3 North America
8.3.1 Market size and forecast
8.4 Middle East and Africa (MEA)
8.4.1 Market size and forecast
8.5 South America
8.5.1 Market size and forecast
Part 9. Key competitor profiles
9.1 Advanced Micro Devices, Inc.
9.2 Amkor Technology, Inc.
9.3 Apple Inc.
9.4 Fujitsu Limited
9.5 IBM Corporation
9.6 Intel Corporation
9.7 Samsung Electronics Co., Ltd.
9.8 Taiwan Semiconductor Manufacturing Company Limited
9.9 Texas Instruments Incorporated
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