Global Flip Chip Market, 2021-2027

  • Report Code : GCC754144
  • Pages : 92
  • Published On : Aug 2021
  • Industry : Electronics
  • Format :

Choose License Type

Single User License: US$ 2,600
Multi User License: US$ 5,200
Corporate User License: US$ 7,800
The global flip chip market, in terms of revenue, is expected to grow by 6.3 percent annually through 2027, according to a new report by Gen Consulting Company.

The report provides in-depth analysis and insights regarding the current global market scenario, latest trends and drivers into global flip chip market. It offers an exclusive insight into various details such as market size, key trends, competitive landscape, growth rate and market segments.

The flip chip market is segmented on the basis of packaging technology, bumping technology, end user, and region. The flip chip market is segmented as below:

By packaging technology:
- 2.5D IC
- 2D IC
- 3D IC

By bumping technology:
- copper pillar
- gold bumping
- solder bumping
- others

By end user:
- aerospace & defense
- automotive & transport
- electronics
- healthcare
- industrial
- IT
- others

By region:
- region
- Asia-Pacific
- Europe
- North America
- Middle East and Africa (MEA)
- South America

The report explores the recent developments and profiles of key vendors in the Global Flip Chip Market, including Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple Inc., Fujitsu Limited, IBM Corporation, Intel Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated, among others.
*REQUEST FREE SAMPLE TO GET A COMPLETE LIST OF COMPANIES

Historical & Forecast Period
This research report provides analysis for each segment from 2017 to 2027 considering 2020 to be the base year.

Scope of the Report
- To analyze and forecast the market size of the global flip chip market.
- To classify and forecast the global flip chip market based on packaging technology, bumping technology, end user, and region.
- To identify drivers and challenges for the global flip chip market.
- To examine competitive developments such as mergers & acquisitions, agreements, collaborations and partnerships, etc., in the global flip chip market.
- To conduct pricing analysis for the global flip chip market.
- To identify and analyze the profile of leading players operating in the global flip chip market.

Why Choose This Report
- Gain a reliable outlook of the global flip chip market forecasts from 2021 to 2027 across scenarios.
- Identify growth segments for investment.
- Stay ahead of competitors through company profiles and market data.
- The market estimate for ease of analysis across scenarios in Excel format.
- Strategy consulting and research support for three months.
- Print authentication provided for the single-user license.
Part 1. Introduction
1.1 Market definition
1.2 Key benefits
1.3 Market segment
Part 2. Methodology
2.1 Primary
2.2 Secondary
Part 3. Executive summary

Part 4. Market overview
4.1 Introduction
4.2 Market dynamics
4.2.1 Drivers
4.2.2 Restraints

Part 5. Global market for flip chip by packaging technology
5.1 2.5D IC
5.1.1 Market size and forecast
5.2 2D IC
5.2.1 Market size and forecast
5.3 3D IC
5.3.1 Market size and forecast

Part 6. Global market for flip chip by bumping technology
6.1 Copper pillar
6.1.1 Market size and forecast
6.2 Gold bumping
6.2.1 Market size and forecast
6.3 Solder bumping
6.3.1 Market size and forecast
6.4 Others
6.4.1 Market size and forecast

Part 7. Global market for flip chip by end user
7.1 Aerospace & defense
7.1.1 Market size and forecast
7.2 Automotive & transport
7.2.1 Market size and forecast
7.3 Electronics
7.3.1 Market size and forecast
7.4 Healthcare
7.4.1 Market size and forecast
7.5 Industrial
7.5.1 Market size and forecast
7.6 IT
7.6.1 Market size and forecast
7.7 Others
7.7.1 Market size and forecast

Part 8. Global market for flip chip by region
8.1 Asia-Pacific
8.1.1 Market size and forecast
8.2 Europe
8.2.1 Market size and forecast
8.3 North America
8.3.1 Market size and forecast
8.4 Middle East and Africa (MEA)
8.4.1 Market size and forecast
8.5 South America
8.5.1 Market size and forecast

Part 9. Key competitor profiles
9.1 Advanced Micro Devices, Inc.
9.2 Amkor Technology, Inc.
9.3 Apple Inc.
9.4 Fujitsu Limited
9.5 IBM Corporation
9.6 Intel Corporation
9.7 Samsung Electronics Co., Ltd.
9.8 Taiwan Semiconductor Manufacturing Company Limited
9.9 Texas Instruments Incorporated
*REQUEST FREE SAMPLE TO GET A COMPLETE LIST OF COMPANIES

DISCLAIMER
ABOUT GEN CONSULTING COMPANY

Chip-based Oligonucleotide Synthesis Market Size And Share Analysis - Growth Trends And Forecasts (2024-2031)...

The Chip-based Oligonucleotide Synthesis Market is set to witness immense growth during the forecast period 2024-2031. This intelligence report offers an in-depth analysis of the market size, share, growth, opportunity, competitive landscape...

Voice Chip Solution Market Size And Share Analysis - Growth Trends And Forecasts (2024-2031)...

The Voice Chip Solution Market is set to witness immense growth during the forecast period 2024-2031. This intelligence report offers an in-depth analysis of the market size, share, growth, opportunity, competitive landscape, manufacturers/p...

Semiconductor Single Chip Power Solutions Market Size And Share Analysis - Growth Trends And Forecasts (2024-2031)...

The Semiconductor Single Chip Power Solutions Market is set to witness immense growth during the forecast period 2024-2031. This intelligence report offers an in-depth analysis of the market size, share, growth, opportunity, competitive land...

Chip Yield Management Software Market Size And Share Analysis - Growth Trends And Forecasts (2024-2031)...

The Chip Yield Management Software Market is set to witness immense growth during the forecast period 2024-2031. This intelligence report offers an in-depth analysis of the market size, share, growth, opportunity, competitive landscape, manu...

Asia Pacific Outsourced Semiconductor Assembly and Test Services (OSAT) Market Size, Share, Trends & Analysis by Service Type (Assembly Services, Testing Services), by Packaging (Ball Grid Array, Chip Scale Package, Stacked Die, Multi Package, Quad and Dual), by Application (Consumer Electronics, Automotive, Industrial, Telecommunications, Others), and Region, with Forecasts from 2024 to 2034....

Market Overview The Asia Pacific Outsourced Semiconductor Assembly and Test Services (OSAT) Market is set for significant growth over the next decade, driven by surging demand for sophisticated semiconductor devices, the expansion of consumer electronics, and the rapid advancement of te...

Europe Outsourced Semiconductor Assembly and Test Services (OSAT) Market Size, Share, Trends & Analysis by Service Type (Assembly Services, Testing Services), by Packaging (Ball Grid Array, Chip Scale Package, Stacked Die, Multi Package, Quad and Dual), by Application (Consumer Electronics, Automotive, Industrial, Telecommunications, Others), and Region, with Forecasts from 2024 to 2034....

Market Overview The Europe Outsourced Semiconductor Assembly and Test Services (OSAT) Market is poised for substantial growth over the next decade, driven by increasing demand for advanced semiconductor devices, the proliferation of consumer electronics, and the rapid advancement of tec...

North America Outsourced Semiconductor Assembly and Test Services (OSAT) Market Size, Share, Trends & Analysis by Service Type (Assembly Services, Testing Services), by Packaging (Ball Grid Array, Chip Scale Package, Stacked Die, Multi Package, Quad and Dual), by Application (Consumer Electronics, Automotive, Industrial, Telecommunications, Others), and Region, with Forecasts from 2024 to 2034....

Market Overview The North America Outsourced Semiconductor Assembly and Test Services (OSAT) Market is poised for substantial growth over the next decade, driven by increasing demand for advanced semiconductor devices, the proliferation of consumer electronics, and the rapid advancement...

Global Outsourced Semiconductor Assembly and Test Services (OSAT) Market Size, Share, Trends & Analysis by Service Type (Assembly Services, Testing Services), by Packaging (Ball Grid Array, Chip Scale Package, Stacked Die, Multi Package, Quad and Dual), by Application (Consumer Electronics, Automotive, Industrial, Telecommunications, Others), and Region, with Forecasts from 2024 to 2034....

Market Overview The Global Outsourced Semiconductor Assembly and Test Services (OSAT) Market is projected to experience significant growth over the next decade, with an estimated compound annual growth rate (CAGR) of XX.XX% from 2024 to 2034. Valued at USD XXX.XX billion in 2024, the ma...

Security Authentication Chip Market Size And Share Analysis - Growth Trends And Forecasts (2024-2031)...

The Security Authentication Chip Market is set to witness immense growth during the forecast period 2024-2031. This intelligence report offers an in-depth analysis of the market size, share, growth, opportunity, competitive landscape, manufa...

Intelligent Driving Chip for NOA Solution Market Size And Share Analysis - Growth Trends And Forecasts (2024-2031)...

The Intelligent Driving Chip for NOA Solution Market is set to witness immense growth during the forecast period 2024-2031. This intelligence report offers an in-depth analysis of the market size, share, growth, opportunity, competitive land...