Europe advanced IC substrates market was valued at $540.8 million in 2021 and will grow by 5.3% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 33 tables and 50 figures, this 110-page report "Europe Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity." is based on a comprehensive research of the entire Europe advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter's Fiver Forces
The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.
Based on Packaging Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types
Based on Material Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
By Manufacturing Method, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
By Bonding Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
By Application, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
Geographically, the following national/local markets are fully investigated:
• Germany
• UK
• France
• Spain
• Italy
• Netherlands
• Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 7
1.1 Industry Definition and Research Scope 7
1.1.1 Industry Definition 7
1.1.2 Research Scope 8
1.2 Research Methodology 11
1.2.1 Overview of Market Research Methodology 11
1.2.2 Market Assumption 12
1.2.3 Secondary Data 12
1.2.4 Primary Data 12
1.2.5 Data Filtration and Model Design 13
1.2.6 Market Size/Share Estimation 14
1.2.7 Research Limitations 15
1.3 Executive Summary 16
2 Market Overview and Dynamics 19
2.1 Market Size and Forecast 19
2.1.1 Impact of COVID-19 on World Economy 20
2.1.2 Impact of COVID-19 on the Market 25
2.2 Major Growth Drivers 27
2.3 Market Restraints and Challenges 32
2.4 Emerging Opportunities and Market Trends 35
2.5 Porter's Fiver Forces Analysis 39
3 Segmentation of Europe Market by Packaging Type 43
3.1 Market Overview by Packaging Type 43
3.2 FC BGA 45
3.3 FC CSP 46
3.4 Other Packaging Types 47
4 Segmentation of Europe Market by Material Type 48
4.1 Market Overview by Material Type 48
4.2 Rigid Integrated Circuit Substrate 50
4.3 Flex Integrated Circuit Substrate 51
4.4 Ceramic Integrated Circuit Substrate 52
5 Segmentation of Europe Market by Manufacturing Method 53
5.1 Market Overview by Manufacturing Method 53
5.2 Subtraction Process (SP) 55
5.3 Addition Process (AP) 56
5.4 Modified Semi-additive Process (MSAP) 57
6 Segmentation of Europe Market by Bonding Technology 58
6.1 Market Overview by Bonding Technology 58
6.2 Wire Bonding 60
6.3 FC Bonding 62
6.4 Tape Automated Bonding (TAB) 64
7 Segmentation of Europe Market by Application 65
7.1 Market Overview by Application 65
7.2 Mobile and Consumer Electronics 67
7.3 Automotive and Transportation 68
7.4 IT and Telecom 69
7.5 Other Applications 70
8 European Market 2021-2031 by Country 71
8.1 Overview of European Market 71
8.2 Germany 74
8.3 U.K. 76
8.4 France 78
8.5 Spain 80
8.6 Italy 82
8.7 Netherlands 84
8.8 Rest of European Market 86
9 Competitive Landscape 88
9.1 Overview of Key Vendors 88
9.2 New Product Launch, Partnership, Investment, and M&A 91
9.3 Company Profiles 92
ASE Group 92
AT&S Austria Technologie & Systemtechnik AG 94
Fujitsu Ltd. 95
IBIDEN Co., Ltd. 96
Kinsus Interconnect Technology Corp. 97
Korea Circuit Co., Ltd. 98
KYOCERA Corporation 99
LG Innotek Co., Ltd. 100
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 101
Shenzhen Fastprint Circuit Tech 102
Shinko Electric Industries Co., Ltd. 103
Siliconware Precision Industries Co., Ltd. 104
STATS ChipPAC Pte. Ltd. 105
TTM Technologies Inc. 106
Unimicron Corporation 107
Zhen Ding Technology Holding Ltd. 108
Zhuhai ACCESS Semiconductor 109
RELATED REPORTS 110
The Advanced Digital Pathology Solutions Market is set to witness immense growth during the forecast period 2024-2031. This intelligence report offers an in-depth analysis of the market size, share, growth, opportunity, competitive landscape...
Market Overview
The Europe Banking as a Service (BaaS) Market is set to experience significant growth from 2024 to 2034, driven by the rapid digital transformation of the financial sector, the increasing adoption of embedded finance solutions, and the rising demand for seamless customer...
Market Overview
The Europe Perfume Packaging Market is poised for substantial growth from 2024 to 2034, fueled by rising consumer demand for premium fragrances, evolving aesthetic preferences, and the growing emphasis on sustainable packaging solutions. The market is projected to achiev...
Market Overview
The Europe Alternate Marine Power (AMP) Market is set to witness remarkable growth from 2024 to 2034, driven by stringent environmental regulations, increasing adoption of green maritime technologies, and the pressing need to reduce greenhouse gas (GHG) emissions in the ...
Market Overview
The Europe Bio Vanillin Market is poised for significant growth from 2024 to 2034, driven by rising consumer preference for natural and sustainable food ingredients, stringent regulatory measures against synthetic additives, and increasing applications in diverse industr...
Market Overview
The Europe AI-Enabled Biometric Market is expected to experience substantial growth from 2024 to 2034, driven by the rising demand for enhanced security systems, increasing adoption of artificial intelligence (AI) technologies, and the need for more efficient biometric i...
Market Overview
The Europe Commercial Vehicle Telematics Market is set to experience robust growth from 2024 to 2034, driven by the increasing adoption of connected technologies, enhanced fleet management solutions, and the need for real-time data analytics across commercial vehicle ope...
Market Overview
The Europe Passive Optical Network (PON) Market is anticipated to experience significant growth from 2024 to 2034, driven by the increasing demand for high-speed internet, data services, and the transition towards fiber-based broadband solutions. As fiber-optic networks ...
Market Overview
The Europe Safety Valves Market is projected to witness steady growth from 2024 to 2034, driven by rising demand across critical industries such as oil and gas, energy and power, and water treatment. With increased focus on safety and regulatory compliance, the market is...
The Advanced Transportation Management Systems Market is set to witness immense growth during the forecast period 2024-2031. This intelligence report offers an in-depth analysis of the market size, share, growth, opportunity, competitive lan...