Asia Pacific substrate-like PCB (SLP) market will grow by 15.6% annually with a total addressable market cap of $ 25,000.1 million over 2022-2031, driven by SLP's ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization.
Highlighted with 26 tables and 36 figures, this 88-page report "Asia Pacific Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Country: Trend Forecast and Growth Opportunity" is based on a comprehensive research of the entire Asia Pacific substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter's Fiver Forces
The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Country.
Based on Inspection Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Automated Optical Inspection (AOI)
• Direct Imaging (DI)
• Automated Optical Shaping (AOS)
Based on Line/Space, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• 25/25 and 30/30 μm
• Less than 25/25 μm
By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• Automotive Industry
• Medical Industry
• Industrial Use
• Computing and Communications
• Other Applications
Geographically, the following national/local markets are fully investigated:
• Japan
• China
• South Korea
• Australia
• India
• Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Inspection Technology, Line/Space and Application over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 6
1.1 Industry Definition and Research Scope 6
1.1.1 Industry Definition 6
1.1.2 Research Scope 7
1.2 Research Methodology 10
1.2.1 Overview of Market Research Methodology 10
1.2.2 Market Assumption 11
1.2.3 Secondary Data 11
1.2.4 Primary Data 11
1.2.5 Data Filtration and Model Design 12
1.2.6 Market Size/Share Estimation 13
1.2.7 Research Limitations 14
1.3 Executive Summary 15
2 Market Overview and Dynamics 17
2.1 Market Size and Forecast 17
2.1.1 Impact of COVID-19 on World Economy 18
2.1.2 Impact of COVID-19 on the Market 20
2.2 Major Growth Drivers 22
2.3 Market Restraints and Challenges 26
2.4 Emerging Opportunities and Market Trends 29
2.5 Porter's Fiver Forces Analysis 33
3 Segmentation of Asia Pacific Market by Inspection Technology 37
3.1 Market Overview by Inspection Technology 37
3.2 Automated Optical Inspection (AOI) 39
3.3 Direct Imaging (DI) 40
4 Segmentation of Asia Pacific Market by Line/Space 41
4.1 Market Overview by Line/Space 41
4.2 25/25 and 30/30 μm 43
4.3 Less than 25/25 μm 44
5 Segmentation of Asia Pacific Market by Application 45
5.1 Market Overview by Application 45
5.2 Consumer Electronics 47
5.3 Automotive Industry 48
5.4 Medical Industry 49
5.5 Industrial Use 50
5.6 Computing and Communications 51
5.7 Other Applications 52
6 Asia-Pacific Market 2021-2031 by Country 53
6.1 Overview of Asia-Pacific Market 53
6.2 Japan 56
6.3 China 59
6.4 Australia 61
6.5 India 63
6.6 South Korea 65
6.7 Rest of APAC Region 67
7 Competitive Landscape 69
7.1 Overview of Key Vendors 69
7.2 New Product Launch, Partnership, Investment, and M&A 72
7.3 Company Profiles 73
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) 73
China Circuit Technology Corporation 75
Compaq Manufacturing Co., Ltd. 76
Daeduck Electronics Co., Ltd. 77
HannStar Board Corporation 78
Ibiden Co., Ltd. 79
Kinsus Interconnect Technology Corp 80
Korea Circuit Co., Ltd. 81
Samsung Electro-Mechanics Co., Ltd. 82
Shenzhen Fastprint Circuit Tech Co., Ltd. 83
Symtek Automation Asia Co., Ltd. 84
TTM Technologies, Inc. 85
Unimicron Technology Corp. 86
Zhen Ding Tech. Group Technology Holding Limited 87
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