Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.3% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 110 tables and 82 figures, this 187-page report "Global Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity" is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter's Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region.
Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types
Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
Geographically, the following regions together with the listed national/local markets are fully investigated:
• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (UAE, Saudi Arabia, South Africa and Rest of MEA)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included.
The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 10
1.1 Industry Definition and Research Scope 10
1.1.1 Industry Definition 10
1.1.2 Research Scope 11
1.2 Research Methodology 14
1.2.1 Overview of Market Research Methodology 14
1.2.2 Market Assumption 15
1.2.3 Secondary Data 15
1.2.4 Primary Data 15
1.2.5 Data Filtration and Model Design 16
1.2.6 Market Size/Share Estimation 17
1.2.7 Research Limitations 18
1.3 Executive Summary 19
2 Market Overview and Dynamics 22
2.1 Market Size and Forecast 22
2.1.1 Impact of COVID-19 on World Economy 24
2.1.2 Impact of COVID-19 on the Market 27
2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery 29
2.2 Major Growth Drivers 33
2.3 Market Restraints and Challenges 38
2.4 Emerging Opportunities and Market Trends 41
2.5 Porter's Fiver Forces Analysis 45
3 Segmentation of Global Market by Packaging Type 49
3.1 Market Overview by Packaging Type 49
3.2 FC BGA 51
3.3 FC CSP 52
3.4 Other Packaging Types 53
4 Segmentation of Global Market by Material Type 54
4.1 Market Overview by Material Type 54
4.2 Rigid Integrated Circuit Substrate 56
4.3 Flex Integrated Circuit Substrate 57
4.4 Ceramic Integrated Circuit Substrate 58
5 Segmentation of Global Market by Manufacturing Method 59
5.1 Market Overview by Manufacturing Method 59
5.2 Subtraction Process (SP) 61
5.3 Addition Process (AP) 62
5.4 Modified Semi-additive Process (MSAP) 63
6 Segmentation of Global Market by Bonding Technology 64
6.1 Market Overview by Bonding Technology 64
6.2 Wire Bonding 66
6.3 FC Bonding 68
6.4 Tape Automated Bonding (TAB) 70
7 Segmentation of Global Market by Application 71
7.1 Market Overview by Application 71
7.2 Mobile and Consumer Electronics 73
7.3 Automotive and Transportation 74
7.4 IT and Telecom 75
7.5 Other Applications 76
8 Segmentation of Global Market by Region 77
8.1 Geographic Market Overview 2021-2031 77
8.2 North America Market 2021-2031 by Country 81
8.2.1 Overview of North America Market 81
8.2.2 U.S. 85
8.2.3 Canada 88
8.2.4 Mexico 90
8.3 European Market 2021-2031 by Country 92
8.3.1 Overview of European Market 92
8.3.2 Germany 96
8.3.3 U.K. 98
8.3.4 France 100
8.3.5 Spain 102
8.3.6 Italy 104
8.3.7 Netherlands 106
8.3.8 Rest of European Market 108
8.4 Asia-Pacific Market 2021-2031 by Country/Region 110
8.4.1 Overview of Asia-Pacific Market 110
8.4.2 Japan 114
8.4.3 China 117
8.4.4 Australia 119
8.4.5 Taiwan 121
8.4.6 South Korea 123
8.4.7 Rest of APAC Region 125
8.5 South America Market 2021-2031 by Country 127
8.5.1 Argentina 130
8.5.2 Brazil 132
8.5.3 Chile 134
8.5.4 Rest of South America Market 136
8.6 MEA Market 2021-2031 by Country 137
8.6.1 UAE 140
8.6.2 Saudi Arabia 142
8.6.3 South Africa 144
8.6.4 Other National Markets 146
9 Competitive Landscape 147
9.1 Overview of Key Vendors 147
9.2 New Product Launch, Partnership, Investment, and M&A 150
9.3 Company Profiles 151
ASE Group 151
AT&S Austria Technologie & Systemtechnik AG 153
Fujitsu Ltd. 156
IBIDEN Co., Ltd. 160
Kinsus Interconnect Technology Corp. 162
Korea Circuit Co., Ltd. 164
KYOCERA Corporation 165
LG Innotek Co., Ltd. 168
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 169
Shenzhen Fastprint Circuit Tech 170
Shinko Electric Industries Co., Ltd. 171
Siliconware Precision Industries Co., Ltd. 174
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) 176
TTM Technologies Inc. 179
Unimicron Corporation 182
Zhen Ding Technology Holding Ltd. 185
Zhuhai ACCESS Semiconductor 186
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