Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.1% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 82 tables and 82 figures, this 165-page report "Global Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity." is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter's Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region.
Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types
Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
Geographically, the following regions together with the listed national/local markets are fully investigated:
• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (UAE，Saudi Arabia， South Africa and Rest of MEA)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 9
1.1 Industry Definition and Research Scope 9
1.1.1 Industry Definition 9
1.1.2 Research Scope 10
1.2 Research Methodology 13
1.2.1 Overview of Market Research Methodology 13
1.2.2 Market Assumption 14
1.2.3 Secondary Data 14
1.2.4 Primary Data 14
1.2.5 Data Filtration and Model Design 15
1.2.6 Market Size/Share Estimation 16
1.2.7 Research Limitations 17
1.3 Executive Summary 18
2 Market Overview and Dynamics 21
2.1 Market Size and Forecast 21
2.1.1 Impact of COVID-19 on World Economy 22
2.1.2 Impact of COVID-19 on the Market 27
2.2 Major Growth Drivers 29
2.3 Market Restraints and Challenges 34
2.4 Emerging Opportunities and Market Trends 37
2.5 Porter's Fiver Forces Analysis 41
3 Segmentation of Global Market by Packaging Type 45
3.1 Market Overview by Packaging Type 45
3.2 FC BGA 47
3.3 FC CSP 48
3.4 Other Packaging Types 49
4 Segmentation of Global Market by Material Type 50
4.1 Market Overview by Material Type 50
4.2 Rigid Integrated Circuit Substrate 52
4.3 Flex Integrated Circuit Substrate 53
4.4 Ceramic Integrated Circuit Substrate 54
5 Segmentation of Global Market by Manufacturing Method 55
5.1 Market Overview by Manufacturing Method 55
5.2 Subtraction Process (SP) 57
5.3 Addition Process (AP) 58
5.4 Modified Semi-additive Process (MSAP) 59
6 Segmentation of Global Market by Bonding Technology 60
6.1 Market Overview by Bonding Technology 60
6.2 Wire Bonding 62
6.3 FC Bonding 64
6.4 Tape Automated Bonding (TAB) 66
7 Segmentation of Global Market by Application 67
7.1 Market Overview by Application 67
7.2 Mobile and Consumer Electronics 69
7.3 Automotive and Transportation 70
7.4 IT and Telecom 71
7.5 Other Applications 72
8 Segmentation of Global Market by Region 73
8.1 Geographic Market Overview 2021-2031 73
8.2 North America Market 2021-2031 by Country 77
8.2.1 Overview of North America Market 77
8.2.2 U.S. 81
8.2.3 Canada 84
8.2.4 Mexico 86
8.3 European Market 2021-2031 by Country 88
8.3.1 Overview of European Market 88
8.3.2 Germany 92
8.3.3 U.K. 94
8.3.4 France 96
8.3.5 Spain 98
8.3.6 Italy 100
8.3.7 Netherlands 102
8.3.8 Rest of European Market 104
8.4 Asia-Pacific Market 2021-2031 by Country/Region 106
8.4.1 Overview of Asia-Pacific Market 106
8.4.2 Japan 110
8.4.3 China 113
8.4.4 Australia 115
8.4.5 Taiwan 117
8.4.6 South Korea 119
8.4.7 Rest of APAC Region 121
8.5 South America Market 2021-2031 by Country 123
8.5.1 Argentina 126
8.5.2 Brazil 128
8.5.3 Chile 130
8.5.4 Rest of South America Market 132
8.6 MEA Market 2021-2031 by Country 133
8.6.1 UAE 136
8.6.2 Saudi Arabia 138
8.6.3 South Africa 140
8.6.4 Other National Markets 142
9 Competitive Landscape 143
9.1 Overview of Key Vendors 143
9.2 New Product Launch, Partnership, Investment, and M&A 146
9.3 Company Profiles 147
ASE Group 147
AT&S Austria Technologie & Systemtechnik AG 149
Fujitsu Ltd. 150
IBIDEN Co., Ltd. 151
Kinsus Interconnect Technology Corp. 152
Korea Circuit Co., Ltd. 153
KYOCERA Corporation 154
LG Innotek Co., Ltd. 155
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 156
Shenzhen Fastprint Circuit Tech 157
Shinko Electric Industries Co., Ltd. 158
Siliconware Precision Industries Co., Ltd. 159
STATS ChipPAC Pte. Ltd. 160
TTM Technologies Inc. 161
Unimicron Corporation 162
Zhen Ding Technology Holding Ltd. 163
Zhuhai ACCESS Semiconductor 164
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